Rachel S. Goldman is Associate Professor of Materials Science & Engineering, Applied Physics, and Electrical Engineering & Computer Science at the University of Michigan (UM).
During 2005-2006, she was the Augustus Anson Whitney Fellow at the Radcliffe Institute and Visiting Scientist in the Division of Engineering and Applied Sciences at Harvard University.
Goldman received her B.S. in Physics (high honors with distinction) from UM. During the summers following her sophomore and senior years, Goldman interned at Brookhaven National Laboratory in Upton, NY and Thomson-CSF in Orsay, France.
She then received her M.S. in Applied Physics from Cornell University and her PhD in Materials Science from the University of California, San Diego. Following her PhD, Goldman was a postdoctoral fellow in Physics at Carnegie Mellon University.
In 1997, she joined UM as the Dow Corning Assistant Professor. Goldman is the author of more than 60 publications, including 3 invited reviews and chapters, and she has delivered more than 115 invited talks.
Goldman has received an NSF CAREER Award, the AVS Peter Mark Memorial Award, the UM Ted Kennedy Family Team Award, and a Radcliffe Faculty Fellowship.
She is an active member of APS, AVS, MRS, TMS, and IEEE.
She has served as APS Focus Session Organizer for DCMP, FIAP, and DMP; Chair of the EMPD Division of AVS; Associate Editor of Journal of Vacuum Science and Technology A and Journal of Electronic Materials; and Volume organizer for MRS Bulletin.
Goldman is currently serving 3-year terms on the AVS Board of Directors and the TMS/IEEE Electronic Materials Committee. Statement
My research lies at the boundary between physics and technology, focusing on the mechanisms of fundamental processes including strain relaxation, alloy formation, and diffusion; and correlations between microstructure and electronic and optical properties of semiconductor films, nanostructures, and heterostructures.
I will bring to FIAP the unique experience of having studied and/or worked in a wide variety of institutions; including academia, industry, and national laboratory; and in a variety of academic departments, including Physics, Electrical Engineering, and Materials Science and Engineering.
As FIAP member-at-large, I would work to ensure that FIAP continues to strengthen its unique role at the interface between physics and technology.
I would also promote the professional, scientific, and technological development of FIAP members at the local, National, and International level.